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Keyphrases
Silicon Substrate
100%
Complementary Metal Oxide Semiconductor
100%
Electrochemical Process
100%
Packaging Applications
100%
Vertical Array
100%
CuO Nanotubes
100%
Integrated Circuit Packaging
100%
Copper Nanotubes
100%
Thermal Conductivity
20%
Heat Transfer
20%
Fabrication Methods
20%
Low Resistivity
20%
Nanopore
20%
Aluminum Oxide
20%
Pore Diameter
20%
Surface-to-volume Ratio
20%
Bulk Material
20%
High Thermal Conductivity
20%
Nanotube Structure
20%
Nanotube Alignment
20%
Thermal Conduction
20%
Electrodeposit
20%
Enhanced Thermal Conductivity
20%
Nanotube Arrays
20%
Cu Nanowires
20%
Electrical Interconnect
20%
Engineering
Nanotube
100%
Silicon Substrate
100%
Complementary Metal-Oxide-Semiconductor
100%
Electrochemical Process
100%
Integrated Circuit
100%
Thermal Conductivity
25%
Aluminum Oxide
12%
Volume Ratio
12%
Nanopore
12%
Bulk Material
12%
High Thermal Conductivity
12%
Pore Diameter
12%
Copper (Cu)
12%
Electrical Interconnects
12%
Nanowire
12%
Material Science
Silicon
100%
Electronic Circuit
100%
Nanotube
100%
Complementary Metal-Oxide-Semiconductor Device
100%
Thermal Conductivity
37%
Nanowire
12%
Electrical Resistivity
12%
Aluminum Oxide
12%
Nanopore
12%
Surface (Surface Science)
12%