Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Ho Young Kim; Chang Man Lim; Ki Seok Kim; Jeong Tak Oh; Hwan Hee Jeong; June O. Song; Tae Yeon Seong; Hiroshi Amano

doi:10.1149/2.0171909jss

Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Ho Young Kim, Chang Man Lim, Ki Seok Kim, Jeong Tak Oh, Hwan Hee Jeong, June O. Song, Tae Yeon Seong, Hiroshi Amano

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H₂S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

Original language	English
Pages (from-to)	P165-P170
Journal	ECS Journal of Solid State Science and Technology
Volume	8
Issue number	9
DOIs	https://doi.org/10.1149/2.0171909jss
Publication status	Published - 2019

Bibliographical note

Funding Information:
This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160).

Publisher Copyright:
© 2019 The Electrochemical Society.

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

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10.1149/2.0171909jss

Cite this

@article{ae1128ecd216497fb7ea3a5a7bb591b5,

title = "Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes",

abstract = "We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.",

author = "Kim, {Ho Young} and Lim, {Chang Man} and Kim, {Ki Seok} and Oh, {Jeong Tak} and Jeong, {Hwan Hee} and Song, {June O.} and Seong, {Tae Yeon} and Hiroshi Amano",

note = "Funding Information: This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160). Publisher Copyright: {\textcopyright} 2019 The Electrochemical Society.",

year = "2019",

doi = "10.1149/2.0171909jss",

language = "English",

volume = "8",

pages = "P165--P170",

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publisher = "Electrochemical Society, Inc.",

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T1 - Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

AU - Kim, Ho Young

AU - Lim, Chang Man

AU - Kim, Ki Seok

AU - Oh, Jeong Tak

AU - Jeong, Hwan Hee

AU - Song, June O.

AU - Seong, Tae Yeon

AU - Amano, Hiroshi

N1 - Funding Information: This work was supported by the Global Research Laboratory (GRL) program through the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160). Publisher Copyright: © 2019 The Electrochemical Society.

PY - 2019

Y1 - 2019

N2 - We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

AB - We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

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ER -

Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Abstract

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