Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Ho Young Kim; Chang Man Lim; Ki Seok Kim; Jeong Tak Oh; Hwan Hee Jeong; June O. Song; Tae Yeon Seong; Hiroshi Amano

doi:10.1149/2.0171909jss

Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Ho Young Kim
, Chang Man Lim
, Ki Seok Kim
, Jeong Tak Oh
, Hwan Hee Jeong
, June O. Song
, Tae Yeon Seong^*
, Hiroshi Amano

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H₂S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

Original language	English
Pages (from-to)	P165-P170
Journal	ECS Journal of Solid State Science and Technology
Volume	8
Issue number	9
DOIs	https://doi.org/10.1149/2.0171909jss
Publication status	Published - 2019

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Publisher Copyright:
© 2019 The Electrochemical Society.

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

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@article{ae1128ecd216497fb7ea3a5a7bb591b5,

title = "Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes",

abstract = "We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0\%)-Cu(0.5\%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0\% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6\% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.",

author = "Kim, \{Ho Young\} and Lim, \{Chang Man\} and Kim, \{Ki Seok\} and Oh, \{Jeong Tak\} and Jeong, \{Hwan Hee\} and Song, \{June O.\} and Seong, \{Tae Yeon\} and Hiroshi Amano",

note = "Publisher Copyright: {\textcopyright} 2019 The Electrochemical Society.",

year = "2019",

doi = "10.1149/2.0171909jss",

language = "English",

volume = "8",

pages = "P165--P170",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

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TY - JOUR

T1 - Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

AU - Kim, Ho Young

AU - Lim, Chang Man

AU - Kim, Ki Seok

AU - Oh, Jeong Tak

AU - Jeong, Hwan Hee

AU - Song, June O.

AU - Seong, Tae Yeon

AU - Amano, Hiroshi

PY - 2019

Y1 - 2019

N2 - We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

AB - We investigated the effect of via-holes in the lead-frame on the reliability of blue flip-chip light-emitting diodes (FCLEDs). For bonding, conventional Sn-Ag(3.0%)-Cu(0.5%) solder (SAC) and Ag sintered paste were adopted. Lateral LED, conventional FCLED (c-FCLED), and via-hole FCLED gave efficacies of 218.5, 221.6 and 225 lm/W at 30 mA. The lateral LED sample (bonding material: silicone), c-FCLED sample (SAC), via-hole-type sample (Ag sinter), and via-hole-type sample (SAC) exhibited total thermal resistance of 15.24, 10.19, 8.95, and 11.79 K/W, respectively. The humidity/temperature/H2S gas reliability examinations showed that unlike the via-hole-type samples, the lumen of the c-FCLED was fallen by 15.0% after exposure for 500 h. Furthermore, the c-FCLED exhibited a 19.6% higher forward voltage than the via-hole FCLED after 1,000 thermal-cycles. SEM results showed that unlike the via-hole type FCLED, the c-FCLED underwent cracking after thermal cycle of 1000 times.

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U2 - 10.1149/2.0171909jss

DO - 10.1149/2.0171909jss

M3 - Article

AN - SCOPUS:85072663617

SN - 2162-8769

VL - 8

SP - P165-P170

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 9

ER -

Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

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