Virtual thermal feedback system using thermal conductivity

Jiyong Min; Hojoon Kim; Youngsu Cha

doi:10.1109/UR52253.2021.9494644

Virtual thermal feedback system using thermal conductivity

Jiyong Min, Hojoon Kim, Youngsu Cha

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this paper, a virtual system that can convey thermal stimulus to the human hand is introduced. Specifically, a heat transfer model considering the thermal conductivity of various materials is established for realistic thermal stimulus. To build up the heat transfer model, a series of experiments are conducted by measuring real cases using resistance temperature detector sensors. Also, the model is validated by comparing the theoretical value with the experimental results. The temperature comparison between the heat transfer model and sensing outputs is in good agreement. Furthermore, the established heat transfer model is implemented to a flexible thermoelectric device to demonstrate realistic thermal feedback to a user in the virtual environment.

Original language	English
Title of host publication	2021 18th International Conference on Ubiquitous Robots, UR 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	114-118
Number of pages	5
ISBN (Electronic)	9781665438995
DOIs	https://doi.org/10.1109/UR52253.2021.9494644
Publication status	Published - 2021 Jul 12
Externally published	Yes
Event	18th International Conference on Ubiquitous Robots, UR 2021 - Gangneung-si, Gangwon-do, Korea, Republic of Duration: 2021 Jul 12 → 2021 Jul 14

Publication series

Name	2021 18th International Conference on Ubiquitous Robots, UR 2021

Conference

Conference	18th International Conference on Ubiquitous Robots, UR 2021
Country/Territory	Korea, Republic of
City	Gangneung-si, Gangwon-do
Period	21/7/12 → 21/7/14

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) through the Ministry of Science and ICT (MSIT), Korean Government under Grant 2020R1A2C2005252. (*Corresponding author: Youngsu Cha) J. Min is with Department of Electrical Engineering, Hanyang University, Seoul 04763, Republic of Korea and with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) H. Kim is with the Center for Intelligent and Interactive Robotics, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea and also with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) Y. Cha is with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) Fig. 1. Depiction of conveying realistic thermal feedback in the virtual environment.

Publisher Copyright:
© 2021 IEEE.

ASJC Scopus subject areas

Biomedical Engineering
Mechanical Engineering
Control and Optimization
Artificial Intelligence

Access to Document

10.1109/UR52253.2021.9494644

Cite this

Virtual thermal feedback system using thermal conductivity. / Min, Jiyong; Kim, Hojoon; Cha, Youngsu.
2021 18th International Conference on Ubiquitous Robots, UR 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 114-118 9494644 (2021 18th International Conference on Ubiquitous Robots, UR 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Min, J, Kim, H & Cha, Y 2021, Virtual thermal feedback system using thermal conductivity. in 2021 18th International Conference on Ubiquitous Robots, UR 2021., 9494644, 2021 18th International Conference on Ubiquitous Robots, UR 2021, Institute of Electrical and Electronics Engineers Inc., pp. 114-118, 18th International Conference on Ubiquitous Robots, UR 2021, Gangneung-si, Gangwon-do, Korea, Republic of, 21/7/12. https://doi.org/10.1109/UR52253.2021.9494644

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note = "Funding Information: This work was supported by the National Research Foundation of Korea (NRF) through the Ministry of Science and ICT (MSIT), Korean Government under Grant 2020R1A2C2005252. (*Corresponding author: Youngsu Cha) J. Min is with Department of Electrical Engineering, Hanyang University, Seoul 04763, Republic of Korea and with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) H. Kim is with the Center for Intelligent and Interactive Robotics, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea and also with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) Y. Cha is with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: [email protected]) Fig. 1. Depiction of conveying realistic thermal feedback in the virtual environment. Publisher Copyright: {\textcopyright} 2021 IEEE.; 18th International Conference on Ubiquitous Robots, UR 2021 ; Conference date: 12-07-2021 Through 14-07-2021",

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AB - In this paper, a virtual system that can convey thermal stimulus to the human hand is introduced. Specifically, a heat transfer model considering the thermal conductivity of various materials is established for realistic thermal stimulus. To build up the heat transfer model, a series of experiments are conducted by measuring real cases using resistance temperature detector sensors. Also, the model is validated by comparing the theoretical value with the experimental results. The temperature comparison between the heat transfer model and sensing outputs is in good agreement. Furthermore, the established heat transfer model is implemented to a flexible thermoelectric device to demonstrate realistic thermal feedback to a user in the virtual environment.

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Virtual thermal feedback system using thermal conductivity

Abstract

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Bibliographical note

ASJC Scopus subject areas

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