TY - GEN
T1 - Virtual thermal feedback system using thermal conductivity
AU - Min, Jiyong
AU - Kim, Hojoon
AU - Cha, Youngsu
N1 - Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) through the Ministry of Science and ICT (MSIT), Korean Government under Grant 2020R1A2C2005252. (*Corresponding author: Youngsu Cha) J. Min is with Department of Electrical Engineering, Hanyang University, Seoul 04763, Republic of Korea and with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: miz715@naver.com) H. Kim is with the Center for Intelligent and Interactive Robotics, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea and also with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: hojun5266@korea.ac.kr) Y. Cha is with School of Electrical Engineering, Korea University, Seoul 02841, Republic of Korea (e-mail: ys02@korea.ac.kr) Fig. 1. Depiction of conveying realistic thermal feedback in the virtual environment.
Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/12
Y1 - 2021/7/12
N2 - In this paper, a virtual system that can convey thermal stimulus to the human hand is introduced. Specifically, a heat transfer model considering the thermal conductivity of various materials is established for realistic thermal stimulus. To build up the heat transfer model, a series of experiments are conducted by measuring real cases using resistance temperature detector sensors. Also, the model is validated by comparing the theoretical value with the experimental results. The temperature comparison between the heat transfer model and sensing outputs is in good agreement. Furthermore, the established heat transfer model is implemented to a flexible thermoelectric device to demonstrate realistic thermal feedback to a user in the virtual environment.
AB - In this paper, a virtual system that can convey thermal stimulus to the human hand is introduced. Specifically, a heat transfer model considering the thermal conductivity of various materials is established for realistic thermal stimulus. To build up the heat transfer model, a series of experiments are conducted by measuring real cases using resistance temperature detector sensors. Also, the model is validated by comparing the theoretical value with the experimental results. The temperature comparison between the heat transfer model and sensing outputs is in good agreement. Furthermore, the established heat transfer model is implemented to a flexible thermoelectric device to demonstrate realistic thermal feedback to a user in the virtual environment.
UR - http://www.scopus.com/inward/record.url?scp=85112444252&partnerID=8YFLogxK
U2 - 10.1109/UR52253.2021.9494644
DO - 10.1109/UR52253.2021.9494644
M3 - Conference contribution
AN - SCOPUS:85112444252
T3 - 2021 18th International Conference on Ubiquitous Robots, UR 2021
SP - 114
EP - 118
BT - 2021 18th International Conference on Ubiquitous Robots, UR 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th International Conference on Ubiquitous Robots, UR 2021
Y2 - 12 July 2021 through 14 July 2021
ER -