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Wafer level hermetic packaging for RF-MEMS devices using electroplated gold layers
Gil Soo Park, Ji Hyuk Yu, Sang Won Seo, Woo Beom Choi, Kyeong Kap Paek, Man Young Sung, Heung Woo Park, Sang Kyeong Yun, Byeong Kwon Ju
Research output: Contribution to journal › Article › peer-review