Wavelet-Based Uniformity of Plasma Etching Surface

Byungwhan Kim, Sungmo Kim, Myo Taeg Lim

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Uniformity of plasma etching has been conventionally examined only in terms of etch rate. A uniformity of etching profile surface is increasingly demanded to improve process quality. This is accomplished by applying a discrete wavelet transformation (DWT) to profile images obtained with a scanning electron microscopy. Applicability of DWT-based profile uniformity was evaluated with a tungsten etch experiment, conducted in an SF6 helicon plasma. Its suitability was investigated as a function of process parameters and scale levels. Compared to a conventional metric, the wavelet-based one characterized more effectively the uniformity of profile variations. The proposed metric can be applied to any other plasma-processed surfaces.

Original languageEnglish
Pages (from-to)1313-1316
Number of pages4
JournalIEEE Transactions on Plasma Science
Issue number6 II
Publication statusPublished - 2003 Dec


  • Plasma etching surface
  • Uniformity
  • Wavelet

ASJC Scopus subject areas

  • Nuclear and High Energy Physics
  • Condensed Matter Physics


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