WR-3 band integrated circuits in InP HBT technology

Sanggeun Jeon; Jae Sung Rieh; Moonil Kim

doi:10.1109/ISCAS.2019.8702104

WR-3 band integrated circuits in InP HBT technology

Sanggeun Jeon, Jae Sung Rieh, Moonil Kim

School of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a review of WR-3 band monolithic integrated circuits developed in an InP HBT technology. Envisioning potential applications of terahertz such as short-distance communication, imaging or spectroscopy, various circuit blocks are presented, including power amplifiers, oscillators, mixers, phase shifter, and switch. The design guideline and measurement result of each circuit are provided. Finally, WR-3 band heterodyne transmitter and receiver chips are introduced.

Original language	English
Title of host publication	2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728103976
DOIs	https://doi.org/10.1109/ISCAS.2019.8702104
Publication status	Published - 2019
Event	2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Sapporo, Japan Duration: 2019 May 26 → 2019 May 29

Publication series

Name	Proceedings - IEEE International Symposium on Circuits and Systems
Volume	2019-May
ISSN (Print)	0271-4310

Conference

Conference	2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019
Country/Territory	Japan
City	Sapporo
Period	19/5/26 → 19/5/29

Bibliographical note

Funding Information:
This work is supported by a grant to Terahertz Electronic Device Research Laboratory funded by Defense Acquisition Program Administration and by Agency for Defense Development (UD180025RD). The authors would like to thank Jin-Woo Shin and Zaeill Kim at Agency for Defense Development, Korea for helpful discussion.

Funding Information:
This work is supported by a grant to Terahertz Electronic Device Research Laboratory funded by Defense Acquisition Program Administration and by Agency for Defense Development (UD180025RD).

Publisher Copyright:
© 2019 IEEE

Keywords

Heterodyne receiver and transmitter
Terahertz monolithic integrated circuits
WR-3 band

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ISCAS.2019.8702104

Cite this

Jeon, S., Rieh, J. S., & Kim, M. (2019). WR-3 band integrated circuits in InP HBT technology. In 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings Article 8702104 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2019.8702104

WR-3 band integrated circuits in InP HBT technology. / Jeon, Sanggeun ; Rieh, Jae Sung; Kim, Moonil.
2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8702104 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Jeon, S , Rieh, JS & Kim, M 2019, WR-3 band integrated circuits in InP HBT technology. in 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings., 8702104, Proceedings - IEEE International Symposium on Circuits and Systems, vol. 2019-May, Institute of Electrical and Electronics Engineers Inc., 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019, Sapporo, Japan, 19/5/26. https://doi.org/10.1109/ISCAS.2019.8702104

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abstract = "This paper presents a review of WR-3 band monolithic integrated circuits developed in an InP HBT technology. Envisioning potential applications of terahertz such as short-distance communication, imaging or spectroscopy, various circuit blocks are presented, including power amplifiers, oscillators, mixers, phase shifter, and switch. The design guideline and measurement result of each circuit are provided. Finally, WR-3 band heterodyne transmitter and receiver chips are introduced.",

keywords = "Heterodyne receiver and transmitter, Terahertz monolithic integrated circuits, WR-3 band",

author = "Sanggeun Jeon and Rieh, {Jae Sung} and Moonil Kim",

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WR-3 band integrated circuits in InP HBT technology

Abstract

Publication series

Conference

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this