TY - GEN
T1 - WR-3 band integrated circuits in InP HBT technology
AU - Jeon, Sanggeun
AU - Rieh, Jae Sung
AU - Kim, Moonil
N1 - Funding Information:
This work is supported by a grant to Terahertz Electronic Device Research Laboratory funded by Defense Acquisition Program Administration and by Agency for Defense Development (UD180025RD). The authors would like to thank Jin-Woo Shin and Zaeill Kim at Agency for Defense Development, Korea for helpful discussion.
Funding Information:
This work is supported by a grant to Terahertz Electronic Device Research Laboratory funded by Defense Acquisition Program Administration and by Agency for Defense Development (UD180025RD).
Publisher Copyright:
© 2019 IEEE
PY - 2019
Y1 - 2019
N2 - This paper presents a review of WR-3 band monolithic integrated circuits developed in an InP HBT technology. Envisioning potential applications of terahertz such as short-distance communication, imaging or spectroscopy, various circuit blocks are presented, including power amplifiers, oscillators, mixers, phase shifter, and switch. The design guideline and measurement result of each circuit are provided. Finally, WR-3 band heterodyne transmitter and receiver chips are introduced.
AB - This paper presents a review of WR-3 band monolithic integrated circuits developed in an InP HBT technology. Envisioning potential applications of terahertz such as short-distance communication, imaging or spectroscopy, various circuit blocks are presented, including power amplifiers, oscillators, mixers, phase shifter, and switch. The design guideline and measurement result of each circuit are provided. Finally, WR-3 band heterodyne transmitter and receiver chips are introduced.
KW - Heterodyne receiver and transmitter
KW - Terahertz monolithic integrated circuits
KW - WR-3 band
UR - http://www.scopus.com/inward/record.url?scp=85066795155&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2019.8702104
DO - 10.1109/ISCAS.2019.8702104
M3 - Conference contribution
AN - SCOPUS:85066795155
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
BT - 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Symposium on Circuits and Systems, ISCAS 2019
Y2 - 26 May 2019 through 29 May 2019
ER -